ASE Technology's 30% jump in AI packaging revenue and a 4.2x price-to-sales ratio give it a clear valuation edge over Lam Research.
ASE Technology Holding Co. posted record first-quarter ATM revenue of NTD 112.4 billion, up 30% from a year earlier, as AI chip packaging demand reshaped seasonal patterns and gave the Taiwanese outsourcer an edge over Lam Research Corp.
"AI-related products are changing the normal demand pattern, helping reduce the impact of seasonality on the business," ASE management said in its earnings release, noting the ATM segment performed better than expected despite fewer working days.
ASE raised its 2026 capital spending plan and boosted its Leading Edge Advanced Packaging revenue outlook by 10%, now expecting LEAP revenue to exceed $3.5 billion. The company's Zacks consensus EPS estimate for 2026 stands at 84 cents, with 2027 at $1.45 — up 23.9% over the past 30 days. Lam Research, by contrast, saw its fiscal 2027 EPS estimate revised up just 0.5% over the past week, while its fiscal 2026 estimate remained unchanged.
The divergence matters because ASE trades at 4.2x trailing sales versus Lam's 20.1x multiple, a roughly 80% discount that offers downside protection even as both stocks have more than doubled year to date — ASE up 150.7% and Lam up 102.8%. With Lam facing uncertainty from semiconductor export restrictions to China and exposure to memory spending cycles, ASE's diversified AI packaging demand across accelerators, power management, and edge devices provides a broader revenue base.
AI Packaging Demand Reshapes the Supply Chain
ASE's ATM business, which covers assembly, testing, and materials, reached a record NTD 112.4 billion in the first quarter of 2026, with sequential growth of 2% defying the typical seasonal slowdown. The company is expanding its advanced packaging technologies — including full-process packaging, CoWoS-like packaging, and panel-level packaging — to support next-generation AI applications. Demand is broadening beyond AI accelerator chips to include AI-related power management, connectivity, sensors, and edge devices.
Lam Research is also benefiting from the packaging boom. The company expects its advanced packaging business to grow more than 50% in 2026, supplying equipment for through-silicon via etch and copper plating — critical processes for connecting chips and memory in AI systems. Foundry revenue rose 35% year over year in the third quarter of fiscal 2026, with management citing advanced packaging as a key driver.
Valuation Gap Favors ASE as Risks Mount for Lam
The valuation disparity between the two stocks is stark. ASE's trailing 12-month price-to-sales ratio of 4.2x is a fraction of Lam's 20.1x, reflecting the market's premium on Lam's equipment monopoly in certain etch and deposition processes. But that premium comes with risks.
Lam faces headwinds from US semiconductor export controls to China, with management expecting China revenue to decline in the fourth quarter of fiscal 2026. The company also remains exposed to memory spending cycles, particularly NAND and DRAM, where any slowdown in AI memory demand could hurt growth. ASE, by contrast, carries a Zacks Rank #1 (Strong Buy) versus Lam's #2 (Buy), and its consensus estimates for 2027 have seen significantly more upward revision momentum.
For investors weighing exposure to the AI semiconductor supply chain, ASE offers a more balanced risk-reward profile. The company's 2026 revenue is expected to grow roughly 19.6%, accelerating to 22.4% in 2027, according to Zacks Consensus Estimates. At 4.2x sales, the stock prices in little of the upside from LEAP expansion, while Lam's 20.1x multiple already reflects high expectations for its equipment dominance. If AI infrastructure spending remains strong — as ASML's second consecutive full-year sales forecast raise this quarter suggests — ASE stands to benefit from packaging demand without the geopolitical overhang that clouds Lam's China exposure.
This article is for informational purposes only and does not constitute investment advice.