ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The firm's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The firm also provides customers with full-stage processing and distribution services. The firm mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
ChipMOS TECHNOLOGIES INC.의 매출은 부문 또는 지역별로 어떻게 나뉘나요?
ChipMOS TECHNOLOGIES INC. 주요 수익원은 Assembly이며, 최신 수익 발표에서 수익은 6,827,404,000입니다. 지역별로는 Taiwan이 ChipMOS TECHNOLOGIES INC.의 주요 시장이며, 수익은 20,784,732,000입니다.
ChipMOS TECHNOLOGIES INC.은 수익성이 있나요?
no, 최신 재무제표에 따르면 ChipMOS TECHNOLOGIES INC.의 순손실은 $0입니다.