BE Semiconductor Industries N.V. (BESIY) Dividends

BE Semiconductor Industries NV engages in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company is headquartered in Duiven, Gelderland and currently employs 1,840 full-time employees. The firm is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company operates through three segments: Die Attach, Packaging and Plating. The company develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The firm offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.